In the development of modern electronic welding technology, the application advantages of laser soldering technology

With the rapid development of modern electronic information technology, integrated circuit chip packaging forms are emerging in endlessly, and the packaging density is getting higher and higher, which has greatly promoted the development of electronic products in the direction of multi-function, high performance, high reliability and low cost. To date, through-hole technology (THT) and surface mount technology (SMT) are common in electronics assembly manufacturing. They have been widely used in PCBA process and have their own advantages or technical fields.

As electronic assemblies become increasingly dense, some through-hole inserts cannot be soldered using traditional wave soldering. The emergence of selective laser soldering technology seems to be a special form of selective soldering technology developed to meet the development requirements of through-hole component welding. Its process can be used as a replacement for wave soldering, and can be used individually The process parameters of solder joints are optimized to achieve the best welding quality.

The evolution of soldering processes for through-hole components

In the development process of modern electronic welding technology, it has experienced two historic changes:

The first time is the transition from through-hole soldering technology to surface mount soldering technology; the second time is the transition we are experiencing from lead soldering technology to lead-free soldering technology.

Laser welding of through hole components

The evolution of welding technology directly brings two results:

First, there are fewer and fewer through-hole components that need to be welded on circuit boards; second, through-hole components (especially large heat capacity or fine-pitch components) are becoming more and more difficult to weld, especially for lead-free and high-quality components. Products with reliability requirements.

Let`s take a look at the new challenges facing the global electronics assembly industry:

Global competition forces manufacturers to bring products to the market in a shorter time to meet the changing requirements of customers; seasonal changes in product demand require flexible manufacturing concepts; global competition forces manufacturers to improve quality on the premise of Reduce operating costs; lead-free production is the general trend. The above challenges are naturally reflected in the selection of production methods and equipment, which is also the main reason why selective laser soldering has developed faster than other welding methods in recent years; of course, the arrival of the lead-free era also promotes its development another important factor.

In the development of modern electronic welding technology, the application advantages of laser soldering technology

Laser soldering machine is one of the process equipment used in manufacturing various electronic components. This process involves soldering specific electronic components to printed circuit boards without affecting other areas of the circuit board, usually involving circuit boards. It is generally completed through three processes of wetting, diffusion and metallurgy. The solder gradually diffuses to the pad metal on the circuit board, forming an alloy layer on the contact surface between the solder and the pad metal, so that the two are firmly bonded. Through the equipment programming device, selective welding is completed for each solder joint in turn.

Advantages of laser soldering machines in electronic manufacturing

In the development of modern electronic welding technology, the application advantages of laser soldering technology

1. Non-contact processing, no stress, no pollution;

2. Laser soldering is of high quality and consistency, with full solder joints and no tin beads remaining;

3. Laser soldering can facilitate automation;

4. The equipment has low energy consumption, is energy-saving and environmentally friendly, has low consumable costs and low maintenance costs;

5. Compatible with larger pads and precision pads, the smallest pad size is up to 60um, making precision welding easy to achieve;

6. The process is simple and can be completed in one welding operation. There is no need to spray/print flux and subsequent cleaning processes.